| 摘要 |
<p>PROBLEM TO BE SOLVED: To operate a surface-mounted light element module at a high temperature without using any Peltier elements and forced air-cooling device by providing a cooling fin at a surface-mounted light element module, and arranging a silicon substrate-mounting surface and a connection terminal for inputting/ outputting an electrical signal in different directions. SOLUTION: A silicon substrate where a laser diode element 1 and a photodiode element for monitoring are mounted is die-bonded to a cooling fin 5 of a package for forming the outer shape of a surface-mounted light-emitting module, and to a metal surface that is subjected to thermal continuity by a hole where metal is filled by a conductive resin with improved thermal conductivity. A circuit substrate 9 with a drive circuit function for driving the surface- mounted light-emitting module, and a surface-mounted light-emitting element module 8 with a light conversion function, are connected to the cooling fin 5 only by a connection terminal 11 projecting from a different direction, and heat transfer by the gas of the surface-mounted light-emitting element module 8 is broken by a case for forming an outer shape.</p> |
