| 摘要 |
PROBLEM TO BE SOLVED: To form a uniformly roughened surface on a copper clad substrate including a plating surface and to improve the adhesion property to a prepreg by using a treating agent prepared by incorporating 5-amino-1H-tetrazole and phenyl urea at specific ratios into an aqueous solution consisting of specific ratios of hydrogen peroxide and sulfuric acid. SOLUTION: This surface treating agent of copper and copper alloy is prepared from the aqueous solution containing, by weight % 1 to 55% hydrogen peroxide, 3 to 15% sulfuric acid, 0.01 to 1% 5-amino-1H-tetrazole and 0.005 to 0.5% phenyl urea. Ion exchange water is preferable as the water. The method for treating the copper clad substrate by using the surface treating agent includes a spray method using a spray etching machine and a dipping method by oscillation, pump circulation, etc. in an etching vessel. The treatment temperature is specified to about 20 to 50 deg.C. Etching of 0.5 to 5μm is usually executed as a measure for the microetching quantity of the copper surface.
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