| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in adhesion to a lead frame, resistance to soldering heat and temperature-cycle properties by compounding an epoxy resin with a curing agent, a filler and a polyethylene derivative containing an ethylene-ethyl acrylate copolymer. SOLUTION: This composition is prepared by compounding (A) 100 pts.wt. epoxy resin containing at least one biphenyl-type epoxy resin of the formula with (B) a curing agent in an equivalent ratio to ingredient A of 0.5-1.5, especially 0.8-1.2, (C) 0.01-10 pts.wt. cure catalyst, (D) 75-98 wt.%, especially 80-95 wt.%, filler having an average particle size of 0.5-28μm and (E) 0.001-20 wt.% polyethylene derivative which contains at least 10 wt.%, especially 20-70 wt.% ethylene-ethyl acrylate copolymer and if necessary a polyethylene wax and has a melt flow rate (190 deg.C, 2,160 g-load) of 2 g/10 min or higher. In the formula, R1 to R8 are each H, 1-4C alkyl or halogen.
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