| 摘要 |
PROBLEM TO BE SOLVED: To enable bonding leads and protrusions, where short circuits are not generated even with a narrow pitch. SOLUTION: This semiconductor device contains a plurality of leads stretching from a first component and a plurality of protrusions 14 arranged on a second component. The leads and the protrusions 14 are mutually bonded by intermetallic eutectic crystal. The protrusions 14 are formed in a configuration, such that the interval between a part 14a of the protrusion 14, which part is near the neck part of the lead and a lead positioned adjacently to the protrusion 14 is different from the interval between a part 14c positioned at an intermediate part of the protrusion 14 and the lead positioned adjacently to the protrusion 14.
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