| 摘要 |
PROBLEM TO BE SOLVED: To produce a tape which has superior warping property, little dimen sional changes due to absorption of moisture, at the same time superior flexibil ity and heat resistance, and a high storage modulus (that is 200 MPa or higher at a temperature in the range of 300 deg.C to 400 deg.C) and hence is useful increasingly as an fine and various semiconductor packaging material. SOLUTION: This tape is formed by laminating polyimide films with a conductive metallic layer therebetween. The polyimide film has a storage modulus of 200 MPa or higher at a temperature in the range of 300 deg.C to 400 deg.C and is made of a polyamide acid, by making total acid dianhydride react with 1-90 mol% p-phenylene bis(trimetallic monoester anhydride) and 10-99 mol% oxydiphthalic dianhydride and by causing with respect to total diamine to react with 25-90 mol% p-phenylenediamine and 10-75 mol% 4,4-diaminodiphenylether.
|
