| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating method for a glass ceramic substrate by which the adhesion between the glass ceramic substrate as a base body and a conductor pattern is satisfactory even in the case electroless plating of nickel-gold is executed to the glass ceramic substrate in which the conductor pattern had been formed. SOLUTION: When forming a nickel layer-gold layer on a conductor pattern on a glass ceramic substrate by electroless plating, a degreasing cleaning stage using an acid treating soln., an etching stage suing an acid etching soln., an acid activating stage using an acid activating soln. and a palladium treating stage using acid and neutral treating solns. are executed in this order, and, after that, to the surface of the conductor pattern, an electroless nickel plating stage in a neutral bath and an electroless gold plating stage in an acid bath or a neutral bath are executed in this order.
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