Probe card for testing semiconductor devices

摘要

A probe card, used for testing the electric characteristics of semiconductor devices, is disclosed. The probe card has main and subsidiary cards. The main card has a main circuit used for testing the electric characteristics of semiconductor devices. The subsidiary card carries a test tip and is detachably attached to the main card into a module when it is necessary to test the electric characteristics of semiconductor devices. A package card in place of the sub-card may be used with the main card. The package card is used for testing the electric characteristics of semiconductor packages having semiconductor chips tested by the subsidiary card. Therefore, it is possible for the probe card to effectively compare test data of the semiconductor chips of a wafer to test data of finally bonded and molded semiconductor packages having the above chips.