| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate faulty mounting of a semiconductor device, without filler being separated, and to stabilize quality even in high temperature and humidity surroundings. SOLUTION: This method of manufacturing a film carrier tape for mounting a semiconductor device includes the steps of removing unwanted parts of a metallic foil of a two-layer film carrier tape, in which a base film 4 and a metallic foil 3 are laminated, to form a lead pattern 3a on the base film 4 and mounting a semiconductor device 1 on a lead pattern 3a with a filler 9 interposed between them. In this case, the method includes a step of forming a peeling preventing part 3b on the obverse or reverse surface of the base film 4 in the region 10, where the semiconductor device 1 of the two-layer film carrier tape is mounted, prior to the process of having the semiconductor device 1 mounted.</p> |
