| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element wherein it is easily determined whether a lead is satisfactorily soldered to a mounting surface, even if the mounting surface is not large enough. SOLUTION: A lead 22 protrudes from a semiconductor element body 12 of a semiconductor element 20. Two narrow grooves 24 are formed on one side surface of the lead 22. The narrow groove 24 is formed to pierce through from a lower surface to an upper surface W of the lead 22. Meanwhile, soldering is performed for connecting the semiconductor element 20 to a mounting surface 26. A solder 18 is put on the mounting surface 26, and further the lead 22 of the semiconductor element 20 is mounted thereon, and then the solder 18 is melted by heat treatment for soldering. First, the melted solder 18 spreads all over the lower surface of the lead 22, then the solder 18 creeps up along the narrow grooves 24 to the upper surface W of the lead 22 by capillarity. By visually confirming that the solder 18 has crept up to the upper surface W, it is determined that soldering has been done satisfactorily.
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