发明名称 Method for producing a microelectronic integrated cantilever
摘要 A microelectronic integrated sensor is formed with a cantilever. For the purpose of ensuring a system which is especially invulnerable to mechanical strains during production, the cantilever is placed freely movably on a support, and motion limiters are provided on the edge. The invention also provides for the formation of nitride pillars for supporting the upper layers, in order to further increase the stability. A corresponding production process for producing the sensor is disclosed as well.
申请公布号 US6136631(A) 申请公布日期 2000.10.24
申请号 US19980195935 申请日期 1998.11.19
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 MUELLER, KARLHEINZ;KOLB, STEFAN
分类号 G01P15/125;B81B3/00;G01P15/08;H01L29/84;H01L49/00;(IPC1-7):H01L21/00 主分类号 G01P15/125
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