| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of working processes and to shorten the assembling work time by forming the diameter of a layer of adhesive, etc., for attaching a template to a backing pad larger than the hole of the template and forming a semiconductor wafer, the template, the backing pad, and the inner end of the adhesive layer to the outside. SOLUTION: The layer 3 of an adhesive or pressure sensitive adhesive for sticking or pasting a pasting plate 2 to the bottom of a backing pad 4 is provided and holes 5 having approximately same dimension as the pasting plate 2 are bored at prescribed intervals in the template (color) 6 positioned in the upper face of the backing pad 4. The dimension of the each hole 5 of the template 6 is so set as to obstruct the lateral movement of a semiconductor wafer W, when the semiconductor wafer W is positioned therein. The diameter of the adhesive or paste layer 7 is set larger than the diameter of the hole 5 so that an annular spec 8 is formed in the outer circumferential face of the semiconductor wafer W. |
