| 摘要 |
PROBLEM TO BE SOLVED: To mount an IC without damaging its circuit surface, even if the height of a printed wiring board is uneven by forming a common electrode film on an elastic layer or an organic film, layer formed on Al pads and forming projected electrodes on this common electrode film. SOLUTION: An elastic layer or an organic film layer 20 is formed on an Al pad, serving as a chip terminal for a bare chip IC 4, and a common electrode film 9 is formed so as to cover the elastic layer or the organic film layer 20. Then, a stud bump 6 which is a projected electrode is formed on the film 9. In summary, it is important in this structure of the IC 4 that the layer 20 serving as a so-called space material be present between the bump 6 and the pad 5. The layer 20 is formed of, e.g. polyimide resin, and its thickness is almost 10μm or so.
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