| 摘要 |
PROBLEM TO BE SOLVED: To surely joint a plurality of semiconductor chips to a wiring board with bumps. SOLUTION: A plurality of semiconductor chips 1, arranged at prescribed intervals, are jointed to a wiring board 4 with solder by a flip-chip method. In this case, the semiconductor chips 1 are arranged and then pressed to be fixed provisionally and thereafter are heated to temperatures below the melting point of solder by a hot plate 7, which is provided below the wiring board 4, while the back of each semiconductor chip 1 is uniformly pressed by a pressurizing holder 12 provided with a pressurizing part 10 having a convexly curved surface and a height-adjusting mechanism. Thereafter, the pressing part 10 of the pressing holder 12 is separated from the semiconductor chips 1, and the solder is heated to temperatures above its melting point to joint the semiconductor chips 1 to the wiring board 4 with bumps. The semiconductor chips 1 are prevented from moving in the solder bump jointing process, and are thereby surely jointed to the wiring board 4.
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