发明名称 DOUBLE-FACE POLISHING DEVICE SYSTEM
摘要 PROBLEM TO BE SOLVED: To feed and discharge workpieces automatically, reliably and efficiently into and from double-face polishing device systems with a carrier making rotation-free circular motion. SOLUTION: This system is for a double-face polishing device 11 comprising an upper and a lower surface plate for polishing wafers 10 received in through- holes cut in a carrier by sandwiching them in between from the vertical opposite sides and moving relative to them, and a carrier revolving mechanism for providing rotation-free circular motion for the carrier to revolve the wafers 10. The system comprises carrier stopping means disposed in the carrier revolving mechanism to stop the carrier in a prescribed position, an arm robot 54 having at its tip a wafer holding mechanism 52 so that the wafers 10 are positively fed into and discharged from the carrier through-holes, and workpiece feeding/ discharging means 50 having an image processor for determining the shape and position of the carrier through-holes and wafers 10.
申请公布号 JP2000296463(A) 申请公布日期 2000.10.24
申请号 JP19990105407 申请日期 1999.04.13
申请人 FUJIKOSHI MACH CORP 发明人 INADA YASUO
分类号 B24B37/04;B24B37/08;B24B49/12;H01L21/304 主分类号 B24B37/04
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