| 摘要 |
PROBLEM TO BE SOLVED: To perform day-to-day conduction high temperature shelf test at a low cost by applying pressure to a semiconductor IC wafer and a wafer probe pin module in a contacting direction, and by heating and cooling each of the semiconductor IC wafer and the wafer probe pin module by an individual temperature control system. SOLUTION: In a chamber 6, a wafer 1 to be inspected which is tentatively locked by a chuck holder 4 and a probe pin module 2 are pinched between upper and lower parts by a heating block 3, and are further pressed by a press 7 so that the entire probe pin 2 is completely brought into contact with a wafer to be tested. Then, after the entire probe pin 2 is brought into contact with the bump of the wafer 1 to be inspected, a required power supply and a signal are applied from a power supply/signal source 8 for carrying out a heating/ cooling conduction shelf test, thus easily performing day-to-day conduction high temperature shelf test of many elements at a low cost.
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