| 摘要 |
A thermal module for dissipating heat generated by a component of a computer consists of a heat sink having a top face defining a cavity exposed to a front side of the heat sink and a bottom face defining a passage fixedly receiving an end portion of a heat pipe. The other end of the heat pipe thermally connects with the heat generating component. A number of round rods are integrally formed with the heat sink and extend into the cavity. A fan mounting plate is fixed to the heat sink and has a top face defining a recession for receiving a fan therein, an opening communicating with the recession and a conduit above the round rods and in communication with the fan via the opening. The conduit has a spiral portion and a rectangular outlet. When the fan is activated, an air flow is generated and flows into the conduit via the opening. The spiral portion of the conduit causes the air flow to have a vortical flowing pattern whereby a strong air flow flows through the round rods to effectively displace heat dissipated therefrom. The heated air exists the thermal module via the outlet of the conduit.
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