| 摘要 |
PROBLEM TO BE SOLVED: To embed the micro vias and trenches formed on a wafer without the occurrence of defects such as void, seam or the like by incorporating an organic bivalent sulfur compound and a quaternary ammonium salt adduct consisting of ternary alkyl amine and polyepichlorhydrin respectively at specific ratios into a plating liquid. SOLUTION: The organic bivalent sulfur compound is incorporated at 1 to 300μmol/l and the quaternary ammonium salt adduct consisting of the ternary alkyl amine and the polyepichlorhydrin at 10 to 200μmol/l into the acidic copper plating liquid for forming wiring on the semiconductor wafer. When the concentration of the organic bivalent sulfur compound is specified to yμmol/l and the concentration of the quaternary ammonium salt adduct to xμmol/l, the concentrations are preferably 0.86x+25<=y<=-0.86x+300 and 1<=y<=300, 10<=x<=200. A polyether compound and polyalkyl ethylenediimine are added at need into this copper electroplating liquid.
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