| 摘要 |
An integrated circuit device comprised of a backlapped integrated circuit (IC) and a molding compound. The molding compound is deemed to be secure if it is made of a material which, when tampered, increases the likelihood of damaging a portion of the IC. Otherwise, the molding compound is deemed to be non-secure. This molding compound substantially surrounds the backlapped IC in order to prevent unwanted and unauthorized physical analysis.
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