Mount for semiconductor device

摘要

A semiconductor device includes a semiconductor pellet (1), and a package having a pellet mount portion (21) on which a semiconductor pellet (1) is mounted. The semiconductor pellet (1) is mounted on the pellet mount portion (21) of the package through a joint material (6). The area of the surface of the pellet mount portion (21) on which the semiconductor pellet (1) is mounted is set to be smaller than the area of the surface of the semiconductor pellet (1) which is mounted on the pellet mount portion (21), thereby preventing the climb-up of the joint material (6) along the side surface of the semiconductor pellet (1).