发明名称 SOLID TEMPORARILY BONDING ADHESIVE
摘要 PROBLEM TO BE SOLVED: To obtain the subject adhesive compatible with difference in the quality and/or weight of work materials and various uses of such materials. SOLUTION: The adhesive is intended for work material processing use with a softening point of 50-70 deg.C, adhesive force of 30-50 kg/cm2 and melt viscosity of 20-35 mPa.s at 120 deg.C, for work material processing use and capable of cleanup with a lower alcohol with a softening point of 40-50 deg.C, adhesive force of 40-60 kg/cm2, and melt viscosity of 200-300 mPa.s at 120 deg.C, or for other use(s) with a softening point of 70-90 deg.C, adhesive force of 20-40 kg/cm2, and melt viscosity of 20-35 mPa.s at 120 deg.C.
申请公布号 JP2000297271(A) 申请公布日期 2000.10.24
申请号 JP19990107474 申请日期 1999.04.15
申请人 THE INCTEC INC 发明人 YAMAMOTO KYOICHI;UKO KOUJUN
分类号 H01L21/304;C09J201/00;(IPC1-7):C09J201/00 主分类号 H01L21/304
代理机构 代理人
主权项
地址