发明名称 |
Perforating and slitting die sheet, methods of constructing the same and paper product produced therefrom |
摘要 |
A first method of constructing a die sheet includes covering a die surface with a first, spaced pattern of a first photo-resist material and then covering the first pattern with a second, continuous pattern of a second photo-resist material. A chemical removes material from sections not covered by the second pattern and the second pattern is then removed. A chemical removes material from die surface sections not covered by the first pattern. A second method of constructing a die sheet includes covering sections of a die surface with a pattern of photo-resist material having alternating slitting segments and wider perforating segments. A chemical removes material from uncovered sections and completely undercuts the slitting segments to form slitting sections and undercuts the perforating segments to form higher extending perforating sections.
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申请公布号 |
US6136209(A) |
申请公布日期 |
2000.10.24 |
申请号 |
US19970862627 |
申请日期 |
1997.05.23 |
申请人 |
XYNATECH, INC. |
发明人 |
KANG, PIERSON S. |
分类号 |
B26D3/10;B26D3/08;B26F1/18;B26F1/44;B31D1/02;G09F3/02;G09F3/10;(IPC1-7):B44C1/22;B26D3/06;B26D11/00 |
主分类号 |
B26D3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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