发明名称 POLISHING METHOD AND SYSTEM
摘要 PROBLEM TO BE SOLVED: To hold the performance of a polishing tool at a high level and to polish a workpiece highly precisely by dressing the polishing tool by a dress tool under such dressing conditions as prescribed according to the load ratio of the polishing tool and a polishing quantity distribution of the workpiece. SOLUTION: The arithmetic part 52 of a controller 50 finds the load ratio of a polishing pad 11 from a profile of the polishing pad 11 detected by a surface roughness detector 30 and at the same time finds polishing quantity distribution and mean polishing quantity from polishing quantities of a plurality of points of a wafer 1 detected by a polishing quantity detector 40. A dressing condition-setting part 53 sets dressing conditions based on the value determined by the arithmetic part 52, and the control part 51 transmits a drive control signal to an electropneumatic regulator 28 of a dressing device 20 so that the dressing load in dressing becomes the determined load. The air quantity according to the drive control signal is fed to an air cylinder 24 to push a dressing grindstone chuck 22 and a dressing grindstone 21 against the polishing pad 11.
申请公布号 JP2000296465(A) 申请公布日期 2000.10.24
申请号 JP19990108089 申请日期 1999.04.15
申请人 HITACHI LTD 发明人 OKAWA TETSUO;KOJIMA HIROYUKI;SATO HIDEMI;NISHIGUCHI TAKASHI
分类号 B24B49/18;B24B53/00;G01B21/30;(IPC1-7):B24B49/18 主分类号 B24B49/18
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