发明名称 Method of forming CMOS circuitry including patterning a layer of conductive material overlying field isolation oxide
摘要 A method for forming CMOS DRAM circuitry is disclosed and which includes forming a substrate comprising an array NMOS region, a peripheral NMOS region, and a peripheral PMOS region; forming a pair of insulated and spaced gate lines in the array NMOS region; forming at least one electrically conductive plug in the array NMOS region and which spans between the pair of gate lines; forming a barrier layer over the pair of gate lines in the array NMOS region, the peripheral NMOS and the peripheral PMOS region; and patterning and etching in the peripheral PMOS region to form peripheral PMOS region gate lines including removing a portion of the barrier layer in the PMOS peripheral region and leaving barrier layer material in the NMOS region masking over the electrically conductive plug
申请公布号 US6136637(A) 申请公布日期 2000.10.24
申请号 US19980124560 申请日期 1998.07.28
申请人 MICRON TECHNOLOGY, INC. 发明人 AHMAD, AFTAB;KELLER, DAVID J.;LOWREY, TYLER A.
分类号 H01L21/8234;H01L21/8239;H01L21/8242;(IPC1-7):H01L21/823 主分类号 H01L21/8234
代理机构 代理人
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