| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent short-circuitings between projection terminals or the wiring patterns of a packaging substrate on packaging. SOLUTION: A device 20 is equipped with a number of projection terminals 22, that are used as the terminal for connecting to a packaging substrate and that project extremely short distance outward from the four sides of a nearly square-columnar shaped sealing body 12, where a semiconductor element is sealed inside with resin. The projection terminals 22 orthogonally cross each of four sides of the sealing body 12 on the same surface as the lower surface of the sealing body 12 for projecting. The projection terminals 22 do not retain resin between the projecting terminals 22, and the outer peripheral surface of the projection terminals 22 is exposed from the sealing body 12. In the projection terminal 22, a metal coating where a solder cladding property is increased and at the same time corrosion resistance is superior, is plated. When soldering junctions, since no resin exists between the projection terminals 22, creamy solder creeps into the side surface of the projection terminal, forming a solder bridge by solder to each other, preventing generation of short-circuiting phenomenon, and furthermore, increasing the strength of electrical and mechanical connections with the packaging substrate.</p> |
