SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To simultaneously achieve both thinning and the improvement in mechanical strength of a semiconductor chip, or a package component mounted with the semiconductor chip. SOLUTION: In a semiconductor wafer, where a semiconductor element is formed on one surface 34, or in a semiconductor chip 32 which is formed by dicing the semiconductor wafer, the other surface 36 which is the opposite side of the one surface 34 is polished and turned into a thin film. Polishing scars generated by the polishing are removed, and the other surface 36 is smoothed. In the semiconductor chip 32, the dicing scars are formed on side surfaces 38 (38b, 38d or the like) through dicing, so that the side surfaces 38 are etched together with the other surface 36. Thereby the dicing scars are eliminated together with the polishing scars, and the other surface 36 and the side surfaces 38 are smoothed.