| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a highly reliable surface wave device, capable of improving the strength of a bump junction and hence preventing faulty connection at the bump junction by expanding a solid phase diffused region between a bump and an electrode. SOLUTION: A surface wave element is arranged, such that each electrode land 12 on a base material 10 is made to oppose each electrode pad 25 of the surface wave element 20 corresponding thereto via a bump 51, and the base material 10 while being heated and pressed with ultrasonic waves (vibrations) each electrode pad 25 and electrode land 12 are jointed with a bump 51. Thereafter, a surface wave device is heated by a heating device 62 to subject it to aging at a temperature, for example, of 300 deg.C for about 5 to 20 minutes. |
