| 发明名称 |
Semiconductor device and a method of producing semiconductor device |
| 摘要 |
A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin. |
| 申请公布号 |
SG75958(A1) |
申请公布日期 |
2000.10.24 |
| 申请号 |
SG19990002538 |
申请日期 |
1999.05.20 |
| 申请人 |
HITACHI ULSI SYSTEMS CO., LTD.;HITACHI, LTD. |
发明人 |
YOUICHI KAWATA;KOUJI KOIZUMI;MICHIAKI SUGIYAMA;ATSUSHI FUJISHIMA;YASUYUKI NAKAJIMA;TAKATOSHI HAGIWARA |
| 分类号 |
H01L23/28;H01L21/50;H01L21/56;H01L21/60;H01L23/04;H01L23/31;H01L23/495;H01L23/50 |
主分类号 |
H01L23/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
