| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high heat resistance, excellent developing property and high sensitivity by compounding a reaction product of an epoxy acrylate and a polybasic acid anhydride of a specific base number, an epoxy resin and a photopolymerization initiator. SOLUTION: An epoxy acrylate comprising a reaction product of a two functional epoxy resin and an acrylic acid, and a polybasic acid anhydride of base number: 4 are used. As the epoxy acrylate, among them, a bisphenol A epoxy acrylate is suitable. Usually, per 1 mole of the epoxy acrylate, 0.1-0.9 mole of the polybasic acid anhydride is used. An acid value of the reaction product is preferably about 50-100 mg KOH/g. As the epoxy resin in the case of use for a resist ink, triglycidyl isocyanurate is preferable. The epoxy resin and a photopolymerization initiator are usually used not more than 50 wt.% and 0.1-20 wt.%, respectively, on the basis of a resin component in the composition. |
