| 发明名称 |
Solder bump transfer plate |
| 摘要 |
A solder bump transfer plate having a plurality of solder deposits on the surface non-wettable to molten solder both diameter and spacing of which are both smaller than diameter and spacing of the terminal pads on a semiconductor substrate.
|
| 申请公布号 |
US6136047(A) |
申请公布日期 |
2000.10.24 |
| 申请号 |
US19980222316 |
申请日期 |
1998.12.29 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
KARASAWA, KAZUAKI;NAKANISHI, TERU;AKAMATSU, TOSHIYA |
| 分类号 |
H01L21/60;H05K3/04;H05K3/34;(IPC1-7):H01L23/48;H01L23/52;H01L29/40;H01L21/00;H01L21/64 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
