发明名称 |
Integrated manufacturing packaging process |
摘要 |
A process of fabricating a circuitized substrate is provided which comprising the steps of: providing an organic substrate having circuitry thereon; applying a dielectric film on the organic substrate; forming microvias in said dielectric film; sputtering a metal seed layer on the dielectric film and in said microvias; plating a metallic layer on the metal seed layer; and forming a circuit pattern thereon. |
申请公布号 |
SG75906(A1) |
申请公布日期 |
2000.10.24 |
申请号 |
SG19980005900 |
申请日期 |
1998.12.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JONES GERALD WALTER;KEESLER ROSS WILLIAM;MARKOVICH VOYA RISTA;RUDIK WILLIAM JOHN;WILSON JAMES WARREN;WILSON WILLIAM EARL |
分类号 |
H01L21/48;H05K3/00;H05K3/16;H05K3/38;H05K3/46;(IPC1-7):H05K3/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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