PACKAGE FOR HIGH-FREQUENCY DEVICE

摘要

The present invention relates to a package for a high-frequency device, in which the characteristic impedance can be matched while a gap between the casing and each terminal is maintained wide enough to avoid contact. In the package for a high-frequency device, each metallic terminal is hermetically fixed to a conductive casing and is electrically insulated from the conductive casing by glass. Each metallic terminal extends in parallel with a side wall of the conductive casing while it is separated from the side wall. Each metallic terminal is also flanked by a pair of conductive protruding portions that are formed on a side wall of the conductive casing and extend in the longitudinal direction of each metallic terminal. The conductive protruding portions are formed on either side of each metallic terminal and serve to match the characteristic impedance.