首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHOD AND APPARATUS FOR PLANARIZING UPPER SURFACE OF LIQUID ENCAPSULANT OF SEMICONDUCTOR PACKAGE
摘要
申请公布号
KR100278760(B1)
申请公布日期
2000.10.23
申请号
KR1019970054512
申请日期
1997.10.23
申请人
发明人
分类号
主分类号
代理机构
代理人
主权项
地址
您可能感兴趣的专利
HEAD-FORMING VEGETABLE HARVESTER
METHOD FOR CONSTRUCTING ROOFTOP GARDEN
CIRCULAR SAW TYPE CUTTER APPARATUS FOR LATERAL BRANCH OF BEANS
SOWING UNIT FOR GROWING SEEDLING
RAISING MATERIAL FOR AUTOMOBILE
POLYIMIDE MULTILAYER ENDLESS TUBULAR FILM AND ITS MANUFACTURING METHOD AS WELL AS ITS USE
MECHANICAL PULVERIZING MACHINE
HYDROGENATION CATALYST FOR HYDROCARBON OIL AND METHOD OF HYDROGENATING HYDROCARBON OIL
GAME HALL MONITORING SYSTEM
HYDROPLANING DETECTING METHOD, HYDROPLANING DETECTING DEVICE AND VEHICLE CONTROL SYSTEM
LINE THERMAL PRINTER
MAGNETIC RESONANCE IMAGING APPARATUS
INFORMATION DISPLAYING TOOL OF DISPLAYED MERCHANDISE AND ITS USING METHOD
MOVING SHELF
TIRE PRESSURE DROP WARNING METHOD AND DEVICE
VEHICULAR AIR-CONDITIONING MODULE
ENDOSCOPE
VACUUM CLEANER AND ITS SUCTION PORT BODY
MANY-MOLD REPLACING TYPE MOLDING MACHINE
Mounting device