| 摘要 |
PROBLEM TO BE SOLVED: To quantitatively measure the parallelism between a stage for placing a substrate and a pressure-welding tool for pressure-welding electronic components to the substrate for adjustment. SOLUTION: In the parallelism-measuring device, first a fixing part 7 is placed on a lower reference surface 9A of each reference tool 8, each contact part 5 is brought into contact with an upper reference surface 9B, and each display part 4 is calibrated so that each display part 4 displays the same value as a known interval of 8.000 mm between reference surfaces. Then, a measurement part 2 is placed on a stage 10, each contact part 5 is pressed against by a pressure-welding tool 11, and the lower surface of the pressure-welding tool 11 in reference to the upper surface of the stage 10 at each contact part 5 is measured. After that, while the pressure-welding tool 11 is pressed against each contact part 5, the displacement of four point of the pressure-welding tool 11, namely the inclination of the lower surface of the pressure-welding tool 11 for the upper surface of the stage 10 is adjusted, thus quantitatively measuring the parallelism between the stage 10 and the pressure-welding tool 11 for adjustment. |
