MANUFACTURE OF SEMICONDUCTOR DEVICE, MOLD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE, THE SEMICONDUCTOR DEVICE AND MOUNTING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To improve manufacturing efficiency and reliability of a semiconductor device, in a method of manufacturing a semiconductor device having a chip-size package structure, and a mold for manufacturing the semiconductor device, and the semiconductor and mounting method thereof. SOLUTION: This method of manufacturing a semiconductor device has a resin-sealing process, in which a substrate 16 with a plurality of semiconductor devices on which bumps 12 are disposed, is installed in a cavity 28 of a mold 20, the positions of the disposal of the bumps 12 are supplied with a resin 35 to seal the bumps 12 and a resin layer 13 is formed, a bump-electrode exposure process in which at least the front end sections of the bumps 12 covered with the resin layer 13 are exposed from the resin layer 13, and a separation process, in which the substrate 16 is cut together with the resin layer 13 and separated into individual semiconductor elements.