| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a board supporting mechanism which can ease the adjustment of pin height as well as exchanging of consumables and suitably support a semiconductor board with a large diameter. SOLUTION: This semiconductor processing device for processing a semiconductor board is provided with an evacuated chamber 1, a susceptor 2 which is in the chamber 1 and is provided with at least three through holes, a board supporting member 12 which is inserted into the through hole and supports the semiconductor board 3, a pin 11 whose one end is inserted in the inside of the board supporting member 12, and a pin fixing assembly body to fix the other end of the pin 11, The susceptor 2 is moved downward, so that the board supporting member 12 is pushed up by the pin 11, and the semiconductor board 3 is supported in the air apart from the susceptor 2 by the semiconductor supporting member 12.</p> |
