| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus of applying paste for die bonding having superior responsive characteristic in an intermittent delivery operation for injection and capable of improving coating efficiency. SOLUTION: In an apparatus of coating paste for die bonding of coating paste for bonding semiconductor chips on a substrate, a dispenser 16 is fixed and arranged, an application nozzle 18 for delivering paste from an coating port to coat the paste on a substrate while it is moving is connected by a dispenser 16 and a flexible tube 17, to force feed the paste to the coating nozzle 18 from the dispenser 16. The paste is intermittently delivered by opening/closing of the application port of the coating nozzle 18 by an opening/closing means which is integrally provided in the coating nozzle 18. Thus, a response characteristic in intermittent delivery operation is improved to improve coating efficiency.
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