| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semiconductor laser device formed by sealing a laser diode arranged on an inner lead frame with mold resin in which plane mounting can be simplified, and cost reduction and miniaturization can be realized. SOLUTION: This is a semiconductor laser device formed by sealing a laser diode arranged on an inner lead with mold resin in which plane mounting can be simplified, and cost reduction and miniaturization can be realized. Draftθ1 of a laser outgoing face 91 being a mold face through which laser beams 8 are emitted and transmitted is set so as to be smaller than draftθ2 of a laser non-emitting face 92 being the other mold face, and the draft forming the laser emitting face 91 and the laser non-emitting face 92 is made asymmetrical, and the main face of the inner lead frame is constituted so as to be bent only by the draftθ1 of the laser emitting face 91 so that the optical axis of the laser beam 8 can be made vertical to the laser emitting face 91.</p> |
