MANUFACTURE OF WIRING BOARD AND SEMICONDUCTOR DEVICE USING IT, AND THAT SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To facilitate the handling without making package boards individual pieces, by providing a wiring board with a plurality of package boards which are equipped with slits at their peripheries, and providing one part of the slit with a coupling part which mechanically connects the package board with the periphery of the wiring board and is equipped with a recess at its one part. SOLUTION: A wiring board 1, which is equipped with a plurality of package boards 2, is provided with a slit 4 in the vicinity of each package board 2, and it is further provided with a coupling 5, which mechanically connects the package board 2 with the periphery 3 of the wiring board 1, at one part of the slit 4, and it is provided with a counterbore 6 at one part of the coupling 5. A plurality of package boards exist on that sheet, and the package boards 2 do not become individual pieces, so the handling of the board for the wiring board can be facilitated. Moreover, a sealing agent can be formed, making use of the counterbore 6 and the slit 4, when injecting the sealing agent for mounting electronic parts such as semiconductor chips, etc., mounted on the package board 2.