| 摘要 |
PROBLEM TO BE SOLVED: To reduce the occurrences of defective connections by easily correcting positional deviations between pads and leads. SOLUTION: Leads 13 of an SMT connector with a board fixing pin 12 are roughly positioned with respect to the corresponding pads 21 of a printed board 2, and the pin 12 is caulkingly fitted into a hole 22 to fix the SMT connector with the pin 12 onto the board 2. After fixing, displacements between the leads 13 and the pads 21 are finely corrected. Since a play is present between a mold 11 and the pin 12, and a play exists between each lead 13 and the corresponding pad 21 both in the horizontal and vertical directions, one can make these fine corrections. After the correction of the displacements, the leads 13 and the pads 21 are soldered. Heat produced during soldering may sometimes cause warpage of the mold 11 of the SMT connector with the pin 12. The plays in the vertical direction allows for small warpages and can prevent large warpages. |
