| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board, which can form fine wiring pattern. SOLUTION: In this manufacturing method, a through-hole 14 is formed on a substrate 10 having copper foils 12 on both faces, and copper 16 is plated after a catalyst processing. The through-hole is filled with an insulating material 18, a copper layer on a surface is etched so that the catalyst layer does appear and a thin copper layer 12' is left. An insulating material 19, protruded from the surface is polished and flattened and copper 20, is plated on a surface containing the region of the filled through-hole. The copper layer on the surface is patterned, and a wiring pattern 23 is formed. The copper layer is thinned, so that the catalyst layer is not exposed and therefore a wiring pattern is made fine, without the occurrence of the trouble of peeling of a wiring conductor, and the trouble of an air trap can be also solved. |
