发明名称 METHOD OF TAKING OUT LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To take out lead frames sheet by sheet from among many stacked lead frames, without the lead frames from deforming or dropping. SOLUTION: Many lead frames are stacked on a stage 40 having a lifting mechanism, and the stage 40 is lowered in the condition that the lead frame 11 on the uppermost stage is fixed by pressing the other side in the longitudinal direction of the lead frame 11 at the uppermost stage with a pressing face 21 having an incline, while abutting one side in longitudinal direction of the stacked lead frames 10 with a fixing plate 50, thus the stacked lead frames 10 excluding the lead frame 11 at the uppermost stage are lowered, and the lead frame 11 at the uppermost stage is taken out, with the ends of its topside and downside chucked with a chuck 30, and then the stage 40 is lifted up to elevate the stacked lead frams 10, and again the action of taking out the lead frame at the uppermost stage is repeated.
申请公布号 JP2000294570(A) 申请公布日期 2000.10.20
申请号 JP19990102282 申请日期 1999.04.09
申请人 MATSUSHITA ELECTRONICS INDUSTRY CORP 发明人 HORIKI ATSUSHI;YOSHIDA KAZUHIRO;OKURA ATSUSHI
分类号 H01L21/50;B65H3/08;(IPC1-7):H01L21/50 主分类号 H01L21/50
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