发明名称 CHIP THERMISTOR
摘要 PROBLEM TO BE SOLVED: To provide a thermistor capable of suppressing temperature increase in a circuit board at the time of mounting. SOLUTION: Insulating layers 17a and 17b are formed over the entire surface of both main surfaces of a positive temperature coefficient thermistor 12 by applying and sintering glass paste. A board 16, i.e., a positive thermistor element 16 having no surface electrode formed thereon is laminated onto the layer 17a. This laminated has external electrodes 18 and 19 formed at both ends thereof.
申请公布号 JP2000294403(A) 申请公布日期 2000.10.20
申请号 JP19990095002 申请日期 1999.04.01
申请人 MURATA MFG CO LTD 发明人 ABE YOSHIAKI;HAGA GAKUO
分类号 H01C7/02;H01C1/01;H01C7/00;H05K3/34;(IPC1-7):H01C7/02 主分类号 H01C7/02
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