| 摘要 |
PROBLEM TO BE SOLVED: To make favorable the space factor of, and reduce the area of occupation of, the chip components on a printed board by placing a pair of first lands on a line at an angle to the lines of a printed board in the lateral direction and soldering a first chip component to the first lands. SOLUTION: One 3a and the other 3b of a pair of L-shaped first lands 3 formed on a printed board 1 are positioned on a line K at an angle to a line Y of the printed board 1 in the lateral direction. Cream solder is placed on pairs of first, second, and third lands 3, 4, and 5 by screen printing or the like. Then, first, second, and third chip components 6, 7, and 8 are placed on the cream solder on the first, second, and third lands 3, 4, and 5, respectively, using a mounter. The printed board is transported to a heating furnace, where the cream solder is melted to solder 9 the first, second, and third chip components 6, 7, and 8 to the first, second, and third lands 3, 4, and 5, respectively.
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