| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic circuit module, where the surface of one side of a printed wiring board has been insulated by covering both main surfaces of two conductor layers excluding one conductor layer out of the conductor layers with an insulation material containing thermosetting resin. SOLUTION: Conductor layers 11 and 13 by copper are subjected to press contact bonding to the entire surface of both the surfaces of a glass epoxy laminated material 12, a hole 14 is punched at its specific part, the inner wall of the hole 14 is subjected to copper plating 15, and the through-hole 14 is formed. Then, a wiring pattern 13' is formed on the conductor layer 13 at a side to be insulated, and a glass epoxy laminated material 21 is subjected to press contact bonding to the wiring pattern 13'. After that, a wiring pattern 11' is formed on the conductor layer 11, a resist film is printed on the wiring pattern 11', a double-sided copper-clad substrate 10 is machined to desired dimensions as a printed wiring board 20, and surface-mounting parts 31 are mounted, thus completing an electronic circuit module 30.
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