| 摘要 |
PROBLEM TO BE SOLVED: To remove any contamination stuck to a wafer b cleaning the face of the wafer. SOLUTION: In the contamination removing device of a wafer face, a wafer 4 is carried to a semiconductor aligner by a carrying device 2, and a back face 41 of the wafer 4 is cleaned by a cleaning means 1, before the wafer 4 is placed on a wafer placing plate. The cleaning means 1 is provided with a moving mechanism 5 for moving a scrubber 3 in a three-dimensional space, a rotating mechanism for rotating the scrubber 3, and a sucking means 9 for sucking the contamination removed by the scrubber 3. The scrubber 3 is brought into contact with the back face 41 of the wafer 4, before the wafer is placed on the wafer placing plate, and then the scrubber 3 is rotated and moved to the whole face of the back face 41 of the wafer 4, so that the back face 4 of the wafer 4 can be cleaned, and the removed contamination is sucked by the suction means 9, so that the wafer 4 can be held in a flat state even when the wafer 4 is placed on the placing plate. |
