| 摘要 |
PROBLEM TO BE SOLVED: To prevent clogging of a board-like bump material in a hole part of a die and improve operation rate and processing accuracy of a device, by providing a clogging prevention means for preventing a board-like bump material from clogging when a board-like bump material is formed by punching out a board-like material in ribbon-like solder by a punch and a die. SOLUTION: When punching by a punch 44 is finished, a shaft 41s of an air cylinder 41 is raised and fitting of the punch 44 and a die 45 is released. Simultaneously, compressed air PA1 is supplied into a flange 52 through a through hole 52a of the flange 52. The compressed air PA1 supplied into the flange 52 is emitted to an outside through a hole part shaped in ribbon-like solder 13 by the punch 44 and a hole part 45a of the die 45. At the same time, the compressed air PA1 blows out a board-like bump material 1. |
