发明名称 ANODE JOINTING DEVICE
摘要 PROBLEM TO BE SOLVED: To constitute an anode jointing device in such a way that the device can be provided with a carbon heater covered with a coating having a high abrasion resistance, a strong peel strength, high conductivity, etc. SOLUTION: An anode jointing device is constituted to joint a semiconductor substrate and a glass substrate fed as an assembly 25 formed by bringing their surfaces into contact with each other without using a adhesive. For this device, following items are provided: a DC voltage source 36, a first electrode 37 for impressing a DC voltage upon one side of the assembly 25, and a second electrode for impressing the DC voltage upon the other side of the assembly 25, a carbon heater 32 for heating the assembly 25, and an AC voltage source 35 for impressing an AC voltage upon the heater 32. The surface of the carbon heater 32 is constituted by covering a base material composed mainly of carbon (C) with a film composed of titanium oxide (TiO2) (preferably, containing nickel). Since the titanium oxide film has higher hardness and a higher adhesive property to the base material than a carbon film has, the abrasion resistance and peel strength of the titanium oxide film are improved. When nickel is added to the titanium oxide film, in addition, the film can be used as a current impressing electrode, because the film becomes to have high conductivity.
申请公布号 JP2000294469(A) 申请公布日期 2000.10.20
申请号 JP19990099026 申请日期 1999.04.06
申请人 SEIKO EPSON CORP 发明人 KOMATSU HIROSHI;MIYASHITA TAKESHI
分类号 B23K20/00;B01J19/08;H01L21/02;H05B3/14;(IPC1-7):H01L21/02 主分类号 B23K20/00
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