摘要 |
PROBLEM TO BE SOLVED: To perform highly accurate inspection without causing any trouble in soldering work during mounting process by inspecting a printed wiring board while heating the basic material thereof up to the vicinity of a rated temperature. SOLUTION: Test pins are brought into contact with the circuit to be inspected on a printed wiring board P positioned at an inspecting position by pressing an inspection jig 32 and inspection is performed by supplying a current between test pins. More specifically, conducting state is measured and the circuit to be inspected is checked for conduction and short circuit. During a series of inspections, the wiring board P is heated by hot air blown out from a hot air generator 33 and kept in a temperature range of 100-180 deg.C. Inspected wiring board P is taken out from the jig 32 and carried to a cooling section while being sorted into acceptable one and rejectable one. Since a rejectable wiring board P can be determined by loading it with thermal stress under such temperature/time conditions as causing no deterioration of the wiring board P before and during wiring board inspection(PWB), trouble of conduction can be prevented after mounting work at a client.
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