| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a lead frame which can prevent damage such as cracks in bent parts of leads when the leads are bent. SOLUTION: A lead frame 30 for a surface mounting IC package has the same structure as a prior art lead frame except for provision of grooves 34 and 36 in all leads 32. The grooves 34 and 36 are made in the leads 32 at positions as fulcra at which lead bending is to be done. The grooves 34 are made in the leads so as to be open downwardly at positions immediately outside of a boundary line 18 of a resin sealing region, while the grooves 36 are open upwardly at positions outside of the grooves 34. The grooves 34 and 36 have a U-shape made by chemically etching the leads. The grooves 34 and 36 have a depth of from 1/3 or more to 1/2 or less a thickness t of the leads. When this lead frame is used for the surface mounting IC package and the leads are bent, the effect of provision of the grooves causes bents having no damage such as cracks formed in two bent formation regions of the leads.</p> |
