FORMATION OF SOLDER BUMP AND FORMATION DEVICE

摘要

PROBLEM TO BE SOLVED: To form a bump of a proper size without requiring almost any adjustment operation regardless of density and a pattern of a pad whereon a bump is formed by fixing molten solder to a pad by moving a frame wherein molten solder is put relatively in parallel to a flat surface with a pad. SOLUTION: A formation device 10 wherein a formation member 16 and a container 14 are incorporated integrally is constituted to be supported by a supporting member 38, for example, and is moved in parallel to a substrate 24 by a movement means. A roller 42 is moved by a movement means along a surface 40 of the supporting member 38, and the formation device 10 is moved in parallel to the substrate 24. A solder bump 44 can be formed in a pad 22 on the substrate 24 by extruding molten solder 12 from the container 14 into a chamber 26 of the molding member 16.